The Hong Kong Polytechnic University (PolyU) won two "Global Innovation Awards" at TechConnect World Innovation Conference and Expo 2019 (TechConnect) staged in the United States. It is the third year in a row that PolyU research teams snatched the awards in the world's largest multi-sector event for fostering development and commercialisation of innovations.
The two PolyU winning innovations are:
Ir Prof. Alex WAI, Vice President (Research Development) of PolyU, said, "These awards not only recognise the efforts of our researchers in conducting impactful research, but also affirms PolyU's endeavours in developing and translating our technologies into practical applications with intrinsic value for the benefit of the global community."
There are over 600 submissions at TechConnect each year, from global top tier universities and national laboratories such as Massachusetts Institute of Technology (MIT), Sandia National Laboratories, Argonne National Laboratory and EPFL-LPAC etc. The Innovation Awards go to the top 15% technologies submitted. This year, 30 global awards were presented for non-US-federal-funded innovations across the world, while another 59 national awards were granted to innovations with US federal funding.
The PolyU delegation showcased 21 technologies this year, two of them received global innovation awards at the event held in Boston on 17-19 June. Besides attending various exchange sessions, the delegation also explored product development and co-operation opportunities with industry end-users, multi-national companies and academic institutions for applying the innovations for the benefits of the world.
Over the years, the TechConnect World Innovation Conference and Expo has connected top applied research and early-stage innovations from universities, laboratories, and start-ups with industry end-users and prospectors. More details are available from the official website of the event: https://www.techconnectworld.com/World2019/
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