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Prof. Sandy To
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Ir Prof. Sandy To 杜雪

Professor; Associate Director of State Key Laboratory of Ultra-precision Machining Technology; Director of PCB Technology Centre

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Brief Biosketch

Prof. Sandy, Suet To is a Professor of the Department of Industrial and Systems Engineering of The Hong Kong Polytechnic University, Associate Director of State Key Laboratory of Ultra-precision Machining Technology and Advanced Optics Manufacturing Centre, and Director of PCB Technology Centre. She is an active researcher who focuses on Ultra-precision Machining and Material Science. Her research interests include research on ultra-precision machining of micro-nano structural functional surfaces; research on multi-field-assisted ultra-precision machining of difficult-to-cut materials; and smart manufacturing of ultra-precision machining technology. Prof. To has undertaken more than 25 key research projects as Principal Investigator (PI)/ Co-principal Investigator (Co-PI)/ Project Coordinator (PC). She has co-authored 7 research books, published more than 350 international SCI journal papers, was ranked as the World’s Top 2% most-cited scientists 2025 by Stanford University. Her research outcomes were granted the Natural Science Award and Scientific and Technological Progress Award by the Higher Education Outstanding Scientific Research Output Awards by the Ministry of Education of the PRC, as well as three times, as a supervising teacher, received the Hiwin Doctoral Dissertation Award from the Chinese Mechanical Engineering Society. She has also obtained 26 granted patents and was invited to be the keynote or invited speaker at several international conferences.

Prof. To holds various honorary positions in professional bodies including Board Member of the Asian Society for Precision Engineering and Nanotechnology (ASPEN), Committee Member of the Production Engineering Division of the Chinese Society for Mechanical Engineers (CSME), Associate Member of the International Academy for Production Engineering (CIRP), Fellow of The Hong Kong Institution of Engineers (HKIE), etc. She also serves as Editorial Board member in several international journals, such as Journal of Manufacturing and Materials Processing, Journal of Applied Optics, Journal of Nano-manufacturing and Metrology, International Journal of Extreme Manufacturing and Chinese Journal of Mechanical Engineering.

 

Teaching and Research Specialties

Ultra-precision Machining Technology; Precision Engineering; Materials Engineering

 

External Research Funding Secured

Prof. To has secured more than 25 research grants as Principal Investigator (PI)/ Co-principal Investigator (Co-PI)/ Project Coordinator (PC) with funding amount over 40 million. Selected external research projects are given as follows::

  1. Research on mechanism and surface formation of ultra-precision cutting of difficult-to-machine materials assisted by magnetic-laser dual field coupling (52575539), PI, National Natural Science Foundation of China (NSFC), RMB500,000, 01/2026-12/2029.
  2. Thermoelastic Excitation and Ultrasonic Impact Coupled Machining for Particulate Reinforced Metal Matrix Composites (U19A20104), Co-PI, NSFC, RMB2,470,000, 01/2020-12/2023.
  3. Theoretical Analysis and Practical Application of Spatial Modulation Based Fly-cutting Servo Diamond Machining of Hierarchical Micro/nanostructures (51675455), PI, NSFC, RMB 630,000, 01/2017-12/2020.
  4. The Study of In-process Tool Wear Monitoring and Prediction in Ultra-precision Raster Milling (51275434), PI, NSFC, RMB 790,000, 01/2013-12/2016.
  5. Research on High-efficiency Ultra-precision Damage-free Machining of the Third-generation Semiconductor Substrates (MHP/051/22), PC & Co-PI, Mainland-Hong Kong Joint Funding Scheme (ITF-MHKJFS) funded by MOST/ Innovation and Technology Commission (ITC), HKD 2,455,700, 04/2024-10/2026.
  6. High Precision Process Chains for the Mass Production of Functional Structured Surfaces (ProSurf) (767589), European Union’s Horizon 2020 research and innovation programme, 01/2018-06/2021.
  7. Virtual Spindle based Trans-scale Tool Servo Diamond Cutting of Hierarchical Optical Surfaces (E-PolyU502/17), PI, EC/RGC Collaboration Scheme, HKD 752,972, 01/2018-06/2021.
  8. Magnetic-Vibration Diamond Imprinting System for Machining of Micro/Nano-Structured Surfaces on Difficult-to-Machine Superalloys (15224525), PI, General Research Fund (GRF), HKD 1,108,779, 01/2026-12/2028.
  9. A Novel Oscillation-synchronized Ultra-precision Diamond Milling System for High-performance Fabrication of Microstructured Surfaces (15206824), PI, GRF, HKD 1,134,931, 01/2025-12/2027.
  10. A Novel Multi-axis Cutting System for Ultra-precision Machining of Micro-structured Surfaces on Optical Crystal Materials with Minimized Subsurface Damage (15221322), PI, GRF, HKD 885,779, 11/2022-10/2025.
  11. A Novel Magnetic Field System for Improving Machinability of Difficult to Cut Materials in Ultra-precision Machining (15212518), PI, GRF, HKD 632,421, 01/2019-12/2022.
  12. A Novel Diamond Cutting System for Generation of Hierarchical Micro/nano-structures (15202117), PI, GRF, HKD 582,000, 10/2017-09/2020.
  13. Development of Robot-assisted Ultra-precision Machining Technology and Equipment for Micro/nanostructured Device (GHP/059/23SZ), PC & PI, Innovation and Technology Fund (ITF), HKD 2,968,000, 09/2025-08/2027.
  14. Investigation of a Novel Diamond Coating Process of Hot Filament Chemical Vapor Deposition (HFCVD) for Difficult-to-cut Materials (ITS/246/18FX), ITF, HKD 2,932,500, 06/2019-07/2022.
  15. The Development of Environmentally Friendly Packaging Technology with Anti-counterfeiting Function and 3D Optical Effects (ITS/356/14), PC & PI, ITF, HKD 1,501,600, 05/2015-02/2017.

 

Publications (including Journals, Books, Chapters in Books, Conferences, etc.)

Prof. To has authored and co-authored more than 350 SCI journal papers, over 150 international conferences papers and seven research books. Some selected papers and patents are listed as following:

Research Books:

  1. Yip, W. S., To, S., Zhou, H., & Ren, J. “Sustainable Machining and Micro-machining” Springer Nature, 146 pages, 2025 (ISBN: 978-3-031-82985-7)
  2. To, S., & Wang, S. “Fly Cutting Technology for Ultra-precision Machining” Springer Nature Singapore Pte Ltd, 466 pages, 2023 (ISBN: 978-981-99-0738-0)
  3. Zhang, G., Xu, B., Lu, Y., & To, S. “Fabrication of Micro/Nano Structures Via Precision Machining: Modelling, Processing and Evaluation” Springer Nature, 298 pages, 2023 (ISBN: 978-981-99-1337-4)
  4. To, S., Wang, H., & Lee, W. B. “Materials characterisation and mechanism of micro-cutting in ultra-precision diamond turning” Springer-Verlag Berlin Heidelberg, 266 pages, 2018 (ISBN: 978-3-662-54821-9)
  5. Lee, W.B., To, S. & Cheung, C.F., “Design, Machining and Measurement Technologies of Ultra-precision Freeform Optics”, China Machine Press, 265 pages, 2015 (ISBN 978-7-111-48229-1)
  6. Cheung, C.F., To, S., Lee, W.B., Wang, B. and Jiang, J.B., “Design and Fabrication of Electronic and Optical Systems for Advanced Automotive Lighting”, Vol. 2 – Advanced Optics, The Hong Kong Polytechnic University, 282 pages, November 2007 (ISBN 9-789623-675956)
  7. Lee, W.B., To, S. & Cheung, C.F., “Design and Advanced Manufacturing Technology for Freeform Optics”, The Hong Kong Polytechnic University, 237 pages, July 2005 (ISBN 962-367-476-7)

Selected representative papers:

  1. Xing, Y., Liu, Y., Yin, T., Li, D., Sun, Z., Xue, C., Yip, W.S., & To, S.* (2024). Magnetic and ultrasonic vibration dual-field assisted ultra-precision diamond cutting of high-entropy alloys. International Journal of Machine Tools and Manufacture, 202, 104208. DOI: 10.1016/j.ijmachtools.2024.104208
  2. Du, H., Jiang, M., Wang, Z., Zhu, Z., & To, S.* (2023). Generating micro/nanostructures on magnesium alloy surface using ultraprecision diamond surface texturing process. Journal of Magnesium and Alloys, 11(4), 1472-1483. DOI: 10.1016/j.jma.2022.07.018
  3. Liu, C., Ke, J., Yin, T., Yip, W. S., Zhang, J., To, S.*, & Xu, J. (2024). Cutting mechanism of reaction-bonded silicon carbide in laser-assisted ultra-precision machining. International Journal of Machine Tools and Manufacture, 203, 104219. DOI: 10.1016/j.ijmachtools.2024.104219
  4. Zhao, T., Yin, T., Wu, D., Tan, Y., Li, D., Yip, W.S., & To, S.* (2025). Grindability and microstructural effect of nickel-based superalloys in magnetic field-assisted ultra-precision grinding. International Journal of Machine Tools and Manufacture, 104284. DOI: 10.1016/j.ijmachtools.2025.104284
  5. Jiang, M., Wang, Y., Liu, F., Du, H., Li, Y., Zhang, H., To, S. & Wang, Z. (2022). Inhibiting the Leidenfrost effect above 1,000° C for sustained thermal cooling. Nature, 601(7894), 568-572. DOI: 10.1038/s41586-021-04307-3
  6. Xu, Z., Guo, F., Zhang, B., Yip, W. S., & To, S.* (2024). Development of optimal monitoring strategies for smart ultra-precision machining using social network analysis. Journal of Manufacturing Systems, 75, 24-41. DOI: 10.1016/j.jmsy.2024.05.017
  7. Du, H., Jiang, M., Zhu, Z., Wang, Z., & To, S.* (2022). Ultraprecision tool-servo cutting of pure nickel for fabricating micro/nanostructure arrays. Materials & Design, 221, 110913. DOI: 10.1016/j.matdes.2022.110913
  8. Yip, W. S., To, S.*, & Sun, Z. (2021). Hybrid ultrasonic vibration and magnetic field assisted diamond cutting of titanium alloys. Journal of Manufacturing Processes, 62, 743-752. DOI: 10.1016/j.jmapro.2020.12.037
  9. Zhao, T., To, S.*, Yin, T., & Jiang, X. (2025). Electromagnetic field-assisted ultra-precision grinding of single-crystal Ni-based superalloy. CIRP Annals. DOI: 10.1016/j.cirp.2025.04.049
  10. Sun, Z., To, S.*, Jiao, J., Yip, W., Wang, S., & Wu, H. (2024). High-frequency diamond imprinting of fine-crystallized micro-structured surfaces. CIRP Annals, 73(1), 429-432. DOI: 10.1016/j.cirp.2024.04.094

Selective patents:

  1. To, S., Ji, R.J., Yip, W.S., Chan, K.L., “Turning equipment”, PRC Patent No. ZL2017100610701 (2022)
  2. To, S., Ji, R.J., Chan, K.L., Yip, W.S., “Milling equipment”, PRC Patent No. ZL2017100609738 (2022)
  3. To, S., Wang, W.K., Wang, B., Cheung, K.C., Wang, H.T., “Rapid Prototyping Device and Method for Nano-Microstructure Parts”, PRC Patent No. ZL201710111778.3 (2021)
  4. To, S., Wang, W.K., Wang, B., Cheung, K.C., Wang, H.T., “Design and Manufacturing Method of Freeform Binary Optics for Projection Systems”, PRC Patent No. ZL201710111779.8 (2020)
  5. To, S., Wang, B., Cheung, K.C., Lee, W.B., Wang, W.K., Wong, C.M., “Direct Type Backlight Module for Ultra-thin and Large Displays”, PRC Patent No. ZL201310051842.5 (2017)
  6. To, S., Wang, B., Cheung, K.C., Wang, W.K., “Lens and Light-emitting Device", PRC Patent No. ZL201310484769.0 (2017)
  7. To, S., Lee, W.B., Wang, W.K., Cheung, K.C., “Self-cleaning Plastic Films with Micro-structure of Lotus Leaf and its Manufacturing Method”, PRC Patent No. ZL201110450694.5 (2016)
  8. To, S., Cheung, C.F., Lee, W.B., Jiang J.B., Wang, W.K., "Zoom Lens Module with a Programmable and Microcontroller-controlled Mechanism", PRC Patent No. ZL200810134895.2 (2012)
  9. To, S., Jiang, J.B., Lee, W.B., Cheung, C.F., Wang, W. K., "A High-power LED Street Lighting System with a Modular Lamp Holder", PRC Patent No. ZL200820001242.2 (2008)
  10. To, S., Jiang, J.B., Cheung, C.F., Lee, W.B., Cheung, K.C., "Design of Side Emitting Lens for LED Lighting", PRC Patent No. ZL200510087410.5 (2008)

 

Editorial Membership of Journals

  1. Editorial board member, Journal of Manufacturing and Materials Processing (SCI journal) (2022-present).
  2. Editorial board member, International Journal of Extreme Manufacturing (EI journal) (2019-present).
  3. Editorial board member, Chinese Journal of Mechanical Engineering (SCI journal) (2016-present).
  4. Editorial board member in Journal of Advanced Optics (2016-present).
  5. Editorial board member, Nano-manufacturing and Metrology published by International Society for Nano-manufacturing (ISNM) (2018-present).

 

Selected Significant Awards

  1. 2023 Ten Outstanding Woman in Science and Technology, China (2023).
  2. The 13th Hiwin Doctoral Dissertation Award, The Chinese Mechanical Engineering Society, China (2023).
  3. Silver medal, 49th International Exhibition of Inventions Geneva, Switzerland (2024).
  4. Champion Award, Hong Kong Institution of Engineers (HKIE) Control, Automation and Instrumentation Paper Award (Postgraduate level) 2022/2023, HKSAR, China (2023).
  5. Invention and Entrepreneurship Award - Invention Award (2nd Prize), The China Association of Invention (2022).
  6. Scientific and Technological Progress Award (Second Class), Guangdong Province Science and Technology Award 2019, China (2020).
  7. The 9th Hiwin Doctoral Dissertation Award, The Chinese Mechanical Engineering Society, China (2019).
  8. Gold Award & Outstanding Ultra-precision Engineering Award, Asia International Innovative Invention Award, HKSAR (2019).
  9. The 7th Hiwin Doctoral Dissertation Award, The Chinese Mechanical Engineering Society, China (2017).
  10. Excellent Paper Award for 60th Anniversary of Chinese Journal of Mechanical Engineering, Chinese Mechanical Engineering Society, China (2013).
  11. Natural Science Award (Second Class), Higher Education Outstanding Scientific Research Output Awards 2011, Ministry of Education of PRC, China (2012).
  12. Technology Progress Award (Second Class), Higher Education Outstanding Scientific Research Output Awards 2009, Ministry of Education of PRC, China (2010)
  13. Grand Award- International Press Prize, 36th International Exhibition of Inventions, New Techniques & Products, Geneva (2008).
  14. A Gold Metal from the competition with “special mention” by the jury, 36th International Exhibition of Inventions, New Techniques & Products, Geneva (2008).
  15. Award of the High Scientific and Technological Level of the Invention-presented by Romania Ministry of Education, Research and Youth, 36th International Exhibition of Inventions, New Techniques & Products, Geneva (2008).

 

Committees of International Conferences

  1. Committee member of International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN)
  2. Committee member of The China International Optoelectronic Expo (CIOE)
  3. Committee member of Asia Pacific Conference of Optics Manufacturing (APCOM)
  4. Secretariat of the International Organizing Committee of the International Manufacturing Conference in China (IMCC).
  5. Conference Co-Chair of the 4th CIRP Conference on BioManufacturing (CIRP-BioM 2019), 12-15 Dec 2019, Guangzhou, China.
  6. Chairman of Programme Committee of the 6th Asia Pacific Conference on Optics Manufacturing (APCOM2019), 7-9 Jan 2019, Hong Kong, China.
  7. Conference Co-Chair of the 5th International Conference on Nanomanufacturing (NanoMan 2016), 15-17 Aug 2016, Macau, China.
  8. Co-Chairman of Organizing Committee of the 3rd Asia Pacific Conference on Optics Manufacturing (APCOM 2012), 26-28 Aug 2012 in Changchun, China.
  9. Organizing Co Chairman, 4th International Conference of Asian Society for Precision Engineering And Nanotechnology (ASPEN2011), 16-18 Nov 2011, Hong Kong, China.
  10. Secretariat of the 1st Asia Pacific Conference on Optics Manufacturing (APCOM 2007), 11-13 Jan 2007, Hong Kong, China.
  11. Secretariat of the International Organizing Committee of the 12th International Manufacturing Conference in China (IMCC2006), 21-23 Sept 2006, Xi’an, China.
  12. Member of the Organizing Committee of the Guangzhou-Hong Kong- Macao-Taiwan Engineer Forum, 21-22 Aug 2004, Hong Kong, China.
  13. Member of Organizing Committee of the International Conference on Precision Engineering and Nanotechnology, 28-30 Oct 2002, Changsha, China.
  14. Secretariat of The 10th International Manufacturing Conference in China (IMCC 2002), 11-13 Oct, 2002, Xiamen, China.
  15. Member of the Organizing Committee of the Symposium on Nano-metrology in Precision Engineering, jointly organized by the Department of Manufacturing Engineering of The Hong Kong Polytechnic University and the National Metrology and Measurement Society, 24-25 Nov 1998, Hong Kong, China.

 

Professional Services

  1. Fellow, Hong Kong Institution of Engineers (HKIE) (2025)
  2. Committee Member, Production Section of Chinese Society for Mechanical Engineers (CSME)
  3. Board Member, Asian Society for Precision Engineering and Nanotechnology (ASPEN)
  4. Associate Member, The International Academy for Production Engineering (CIRP) (2018)
  5. Member, The Institute of Electrical and Electronics Engineers, MIEEE (2017)
  6. Member, The Institution of Engineering and Technology, MIET (2007).
  7. Member, International Society for Optical Engineering (2004).
  8. Member, American Society for Precision Engineering, MASPE (2000).
  9. Member, Hong Kong Photographic and Optics Manufacturers Association (2000).

 

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