We are delighted to announce that Ms Haley Kwok Hin Chi, a year 3 student of BSc (Hons) in Enterprise Engineering wit Management programme, is one of the esteemed awardees of the Innovation and Technology Scholarship 2023. The scholarship was jointly established by the Innovation and Technology Commission and The Hongkong and Shanghai Corporation Limited (HSBC), and is now administered by The Hong Kong Federation of Youth Groups (HKFYG).
After a rigorous selection process, Haley was selected as one of the 25 awardees from seven local universities taking science, engineering and health-related programme. The Scholarship aims to recognize outstanding undergraduate students in Hong Kong who have demonstrated exceptional skills and achievements in the field of innovation and technology.
The scholarship provides Haley with an opportunity to expand her international and Mainland exposure, gain industry experience, and contribute to the community through the Overseas / Mainland Attachment Programme, Mentorship Programme, Service Project Programme, and Local Internship Programme.
Haley expressed her gratitude to the professors and mentors for their guidance and support throughout the scholarship application process, as well as to the department for providing her with valuable research experience. She believes that her unwavering dedication and commitment have significantly contributed to her success in winning the Innovation and Technology Scholarship 2023.
"It is a very competitive scholarship. PolyU and ISE have provided full support to me throughout my study. Be innovative and adventurous!" said Haley.
We extend our heartfelt congratulations to Haley and wish her all the best in her future endeavors in the field of innovation and technology.
The Innovation and Technology Scholarship aims to provide recognition to outstanding undergraduates in universities in Hong Kong as well as opportunities of widening their international / Mainland exposure and gaining industry experience. Successful awardees are awarded a scholarship of not more than HK$150,000, comprising the following four components:
- Overseas/ Mainland Attachment Programme
- Mentorship Programme
- Service Project Programme
- Local Internship Programme
|Department of Industrial and Systems Engineering|
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