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Entrance Year Sept 2027

Programme Code 46014

Stream Code

MI (Full-time)
MIT (Part-time)

Mode of Study Mixed Mode

Normal Duration

1.5 years (Full-time)
2.5 years (Part-time)

Fund Type Self-Financed

Credits Required for Graduation

31

Local Application Deadline 25 Feb 2027 *
Early Round: 2026-10-20
Main Round: 2027-02-25

Non-Local Application Deadline 25 Feb 2027 *
Early Round: 2026-10-20
Main Round: 2027-02-25

Tuition Fees

TBC

Programme Leader(s)

Prof. ZHAO Haitao
PhD, MSc, BEng

Remarks

Note to Applicants

The programme has a limited quota for admission.  Early application is strongly encouraged.

Aims and Characteristics

Programme Aims

The Master of Science in Materials Intelligence (MSc in MI) programme aims to achieve the following:

  • To provide students with a comprehensive interdisciplinary foundation in Materials Intelligence, covering AI for Science and AI + Materials research, as well as applications of Embodied AI and Physical AI.

  • To equip students to use AI, robotics, large language models, digital twins and AI agents to accelerate the design, discovery, synthesis and manufacturing of new materials.

  • To enable students to understand and develop advanced materials for AI and robotics industries, including next-generation robotic infrastructure, AI chips, renewable energies and emerging space manufacturing.

 

Characteristics

The MSc in Materials Intelligence offers interdisciplinary training across advanced materials, artificial intelligence, and robotics, with exposure to AI for Science, Embodied AI, and Physical AI. Students will learn through research-informed teaching, practical projects and engagement with leading universities, research institutions and listed companies. Planned collaborations with leading universities and research institutions, such as the University of Oxford and Suzhou National Laboratory, will provide opportunities for guest lectures and research exposure. Students may also access internship opportunities in Suzhou and Wenzhou. Such experiences can help students connect academic knowledge with research, industrial applications and innovation, supporting future careers in AI, digital twins, robotics and new materials.

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