Picosecond Laser Machine
Location: W401j
Process: Laser Machining
Material: Multiple
Specification
- Ultraviolet picosecond laser operating at 355nm, designed for ultra-precise micromachining with minimal heat-affected zones
- Approximately 15 µm for beam diameter, depending on material properties and processing conditions
- Maximum XYZ Travel: 300mm x 300mm x 100mm
- Ideal for applications requiring fine detail and rapid throughput, including semiconductor, biomedical, and microelectronics industries.
- Compatible with dxf files
- Training is required prior to operation by user.
- User must complete the laser safety training (by HSEO) before using the equipment.
