AnlinCore Technology Limited

This project develops a next-generation massively parallel optical interconnect solution for AI data centers. By using high-density micro-LED arrays, micro-optical coupling components, and multi-core optica-fiber links, the solution enables short-reach, high-bandwidth, and low-power data transmission among AI chips, boards, and server racks. Compared with conventional copper interconnects and traditional optical modules, the proposed architecture offers higher bandwidth density, lower energy consumption, better thermal performance, and stronger scalability for future AI computing infrastructure. The project aims to address the growing bandwidth and power bottlenecks in large-scale AI training and inference systems, providing a compact, cost-effective, and reliable optical interconnect platform for next-generation intelligent computing centers.

Key Team Member(s)
Dr LIU Zhongxu (Department of Electrical and Electronic Engineering)
Prof. YU Changyuan (Department of Electrical and Electronic Engineering)
Mr XIE Dawei (Department of Electrical and Electronic Engineering)
Mr DAI Yurong (Department of Electrical and Electronic Engineering)
Mr LUO Mingyu (Department of Electrical and Electronic Engineering)