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Main Feature

The U3DP will be able to support students’ learning and teaching activities as well as accommodating the needs of researchers and academic staff. It has a full range of:

  • Facility and equipment from elementary grade to industrial grade.
  • Materials including commonly used (e.g. plastic) and special type (e.g. biocompatible resin, silver ink, graphene).
  • Technologies from 3D scanning, CAD modelling to 3D printing.
  • Production including multi-material and multi-colour printing.

Located next to PolyU IC, the U3DP is also conveniently supported by IC’s technical workshops in various pre/post-process technologies as well as its expertise with 20 years+ solid research support, development and application experience in 3DP.

Details of our equipments

280-1

SLM®280HL Dual Laser System

Technology Selective Laser Melting (SLM)
Laser Power 400W + 1000W
Building Platform 280 mm x 280 mm x 350 mm
Layer Thickness 20 - 75 µm
Material Ti alloy, Al alloy, Stainless Steel, CoCr Alloy, Inconel, etc.
Application Aviation, Medical Implant, High-strength Lightweight Lattice Structure Components
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SLM®280HL Twin Laser System

Technology Selective Laser Melting (SLM)
Laser Power 400W + 400W
Building Platform 280mm x 280mm x 350mm
Layer Thickness 20-75 µm
Material Ti alloy, Al alloy, Stainless Steel, CoCr Alloy, Inconel, etc.
Application Aviation, Medical Implant, High-strength Lightweight Lattice Structure Components 
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SLM®125HL Single Laser System

Technology Selective Laser Melting (SLM)
Laser Power 400W
Building Platform 125 mm x 125 mm x 75 mm
Layer Thickness 20 - 75 µm
Material Ti Alloy, Al Alloy, SS316, CoCr Alloy, Inconel, etc.
Application Aviation, Medical Implant, High-strength Lightweight Lattice Structure Components
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FDM 900MC

Technology Fused Desposition Modelling (FDM)
Building Platform 914 mm x 609 mm x 914 mm
Layer Thickness 0.125 mm – 0.33 mm
Material
  • Biocompatible Material: ABS M30i, PC ISO
  • High Performance Thermoplastic: UTLEM, PPSF
  • Compatible with Soluble Support
Application 3DP Fixture, Composite Mould Tooling, Production Parts
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FDM 450MC

Technology Fused Desposition Modelling (FDM)
Building Platform 406 mm x 355 mm x 406 mm
Layer Thickness 0.125 - 0.330 mm
Material
  • Biocompatible Material: ABS M30i, PC ISO
  • High Performance Thermoplastic: UTLEM1010, FDM Nylon 12
  • Compatible with Soluble Support
Application Industrial Design, 3DP Injection Mould, End Use Parts
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Perfactory 4

Technology Direct Light Projection (DLP)
Building Platform 160 mm x 100 mm x 230 mm
Layer Thickness 25 - 100 µm
Material
  • ABStuff, ABSflex Flexible Resin,
  • High Temperature Resin (140 DegC),
  • Casting Wax, Hearing Aid Material
Application Jewelry, Dental, Hearing Aid Applicaiton, etc.
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J750 Colour 3D Printer

Technology PolyJet
Building Platform 490 mm x 390 mm x 200 mm
Layer Thickness 14 / 27 µm
Material
  • Digital Material Over 360,000 Colours
  • Rubber-like Matetials
  • Transparent VerClear Material
  • Soluble Support
Application 3DP Fixture, Composite Mould Tooling, Production Parts
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Objet30 Prime 3D Printer

Technology PolyJet
Building Platform 294 mm x 192 mm x 148.6 mm
Layer Thickness 16 - 28 µm
Material

Rigid Opaque, Transparent, Simulated Polypropylene,

Rubber-like, Bio-compatible Material

Application Industrial Design, Fit-form RP, Master Pattern for RTV Duplication, etc.

pro

Objet30 Pro 3D Printer

Technology PolyJet
Building Platform 294 mm x 192 mm x 148.6 mm
Layer Thickness 16 - 28 µm
Material Rigid Opaque, Transparent, Simulated Polypropylene, etc.
Application Industrial Design, Fit-form RP, Master Pattern for RTV Duplication, etc.


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3D Bioplotter®

Technology Bioprinting
Building Platform 150 mm x 150 mm x 140 mm
Available of Print Head
  • Low-Temp 0°- 70°C
  • High-Temp 30°- 250°C
  • UV Curing Head (365 nm)
Layer Thickness 0.08 - 0.32 mm
Material Biomaterial: Hydroxyapatite, PLLA, PLGA, PCL, etc.
Application Biofabrication
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AJ300 Printed Electronic System

Technology Aerosol Jet Printing
Building Platform 300 mm x 300 mm x 50 mm
Size of Nozzle Head 100 - 300 µm
Layer Thickness 100 nm - 2 µm
Material Silver Ink
Application Embedded Passives, Printed Sensors, etc.
Form3

Form 3

Technology Low Force Stereolithography (LFS)
Building Platform 145mm x 145 mm x 185 mm
Layer Thickness 25-300µm
Material

Standard Resins, Dental Resins, Medical Resins,

Specialty Resins

Application Engineering Application, Design Realization

revo

REVO Type E

Technology

Digital Photonic Manufacturing (DPM)

Building Platform 192 mm x 120 mm x 350 mm
Layer Thickness 50 µm
Material Resins
Application Engineering Application, Design Realization


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MakerBot Replicator 5th Gen

Technology Fused Desposition Modeling (FDM)
Building Platform 252 mm x 200 mm x 150 mm
Layer Thickness 0.1 mm
Material PLA Filament
Application Design Realization

MakerBot Replicator

MakerBot Replicator +

Technology Fused Desposition Modeling (FDM)
Building Platform 295 mm x 195 mm x 165mm
Layer Thickness 0.1 mm
Material PLA Filament
Application Design Realization

20

MakerBot Replicator Z-18

Technology Fused Desposition Modeling (FDM)
Building Platform 300 mm x 305 mm x 457 mm
Layer Thickness 0.1 mm
Material PLA Filament
Application Design Realization

SLS

Sinteric LISA PRO 

Technology Selective Laser Sintering (SLS)
Building Platform 150 mm x 200 mm x 260 mm
Layer Thickness 75 - 175 µm
Material PA12, PA11, TPE & PP Powder
Application Engineering Application, Design Realization
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RangeVision Smart 3D Scanner

Technology Structured White Light Scanning
Scanning Zone Setting - 1 Setting - 2 Setting - 3
Measurement Volume (mm) 500 x 375 x 375 300 x 225 x 225 150 x 112 x 112
3D Resolution (mm) 0.4 0.24 0.12
Additional Features Coloured Texture, with Turntable and Support Reference Target Scanning
Application Sculpture, Jewellery Design, Artwork, Reverse Engineering

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Carl Zeiss Comet L3D 5M

Technology Structured White Light Scanning
Scanning Zone Setting - 1 Setting - 2
Measurement Volume (mm) 45 x 38 x 30 120 x 100 x 60
3D Resolution (mm) 0.018 0.05
Additional Features Support Reference Target Scanning
Application Quality Inspection, Reverse Engineering, Mould and Toolmaking
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Thor3D Scanner

Technology Structured White Light Scanning (Handheld)
Scanning Distance (mm) 800 - 1500
Field of View (mm) 700 x 900
Capture Rate (fps) 10
3D Resolution (mm) 1
Additional Features Handheld, Wireless, Colour Texture and Support
Reference Target Scanning
Application Human Body Scanning, Sculpture, Reverse Engineering
and Large Object Scanning

X-1100

XENON X-1100 - High-Intensity Pulsed Light System

Energy to Lamp

37.5 - 2500 J/pulse

Max Power to Lamp, Continuous

750 J/sec

Pulse Length, Range

100 - 7000 µsec

Pulse Length, Increments

100µsec

Pulse Sequence Modes

Single, Burst, Continuous

Application

Sintering Sliver, Copper Nano Conductive and Metallic Inks, etc.


Mastersizer 3000

Particle Size Analyzer Mastersizer 3000

Principe

Laser Light Scattering

Data Acquisition Rate

10kHz

Size Range

10 nm - 3.5 mm

Typical Measurement Time

<10 sec

Materials

Suspensions, Emulsions, Dry Powders


polishing

Grinding Finishing Machine DLyte100D+Ti

Associated Function

Grinding, Polishing

Application

For Dry Polishing, For Dental Applications

Treated materials

Metal, Stainless Steel, Steel, Titanium Alloys

Other Characteristics

Automatic, For High-volume Production


filament extruder

Noztek Xcalibur Filament Extruder

Exturding Speeding

8-10m/minute or 2Kg/hour

Material

Polymer, High Temperature Thermoplastics, Metal Powdered Combinations

Application

For Filament Extruding

 


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