News

Chengming Hu's talk

Compact model serves as a bridge between process technology and circuit design, playing a pivotal role in SPICE simulations. Professor Hu emphasized the importance of open-source initiatives and standardization, recounting how the BSIM model was made freely available to the industry—much like SPICE—to benefit the entire community. He introduced the BSIM-CMG model, developed to support FinFETs and Gate-All-Around (GAA) devices, which features a unified parameter framework capable of covering multiple structural variants. Notably, this model can accurately fit Intel’s FinFET experimental data without requiring access to Intel’s proprietary datasets.

The 9th IEEE Electron Devices Technology and Manufacturing Conference (EDTM 2025)

In commemoration of the 100th anniversary of the invention of the Field-Effect Transistor (FET), the IEEE Electron Devices Society (EDS) held the inaugural FET100 Forum Plenary Session in Hong Kong during the 9th IEEE Electron Devices Technology and Manufacturing Conference (EDTM 2025). Chaired by Prof. Philip C. H. Chan, the forum featured invited keynote speeches from five world-renowned experts, who provided a systematic review encompassing the invention of the FET, its historical evolution, modeling methodologies, transformative impact on the industry, and future trajectories.

Microelectronics Technology Forum 2024 (MTF2024)

The 2nd Microelectronics Technology Forum was successfully held at Hong Kong Science Park (HKSTP) and recorded a high attendance. The organizing committee, consisting of Prof. Han WANG, Prof. Lance LI, Prof. Yang CHAI and Dr. Meikei IEONG, delivered opening remarks with Dr. Ming GE, the Commissioner for Industry (Innovation and Technology) .

The 4th International Symposium on Emerging Memory and Computing (ISMC)

The 4th International Symposium on Emerging Memory and Computing (ISMC), is scheduled to take place in Hong Kong on January 9-11, 2024! Our journey began with the 1st Symposium held at the Hong Kong Polytechnic University from September 22-24, 2017. Building on its success, the 2nd Symposium was hosted in Ji'an City, Jiangxi Province, from August 31 to September 1, 2018, followed by the 3rd Symposium held online and hosted by the Hong Kong Polytechnic University from May 26-29, 2021. This highly anticipated international symposium will bring together distinguished researchers, engineers, and experts from across the globe to exchange their latest findings and insights in the rapidly evolving field of emerging memory and computing.