Compact model serves as a bridge between process technology and circuit design, playing a pivotal role in SPICE simulations. Professor Hu emphasized the importance of open-source initiatives and standardization, recounting how the BSIM model was made freely available to the industry—much like SPICE—to benefit the entire community. He introduced the BSIM-CMG model, developed to support FinFETs and Gate-All-Around (GAA) devices, which features a unified parameter framework capable of covering multiple structural variants. Notably, this model can accurately fit Intel’s FinFET experimental data without requiring access to Intel’s proprietary datasets.
