Prof. YAO Jianping from the University of Ottawa, Canada, delivered the PAIR Seminar titled “Photonic Integrated Circuits for Next-Generation Microwave Photonic Systems” on 11 June 2025 on the PolyU campus.
Prof. Yao began his presentation with an overview of microwave photonics (MWP), emphasising that the technology uses light as a carrier and employs photonic and optoelectronic devices for the generation, transmission, control and processing of microwave signals. He compared the properties of four major material systems including indium phosphide (InP), silicon nitride (Si3N4), lithium niobate on insulator (LNOI) and silicon on insulator (SOI), highlighting that SOI, Si3N4, and LNOI play an important role in the implementation of photonic integrated circuits (PICs).
Next, Prof. Yao explored current applications of photonic integrated MWP systems. These include true time-delay networks for wideband beamforming; optoelectronic oscillators for low-phase-noise, high-frequency microwave generation; and programmable signal processors for versatile photonic signal processing, high-sensitivity optical sensors and integrated MWP radar.
In his closing remarks, Prof. Yao emphasised that the PICs’ small size, wide bandwidth and low loss, enhanced functionality and increased scalability enable the microchips to bring powerful solutions for MWP systems, paving the way for next-generation systems in radar, wireless communications (5G/6G) and AI computing, and delivering greater speed, bandwidth and dynamic range. He also stressed that heterogenous integration is a key challenge in the field—but one that presents opportunities for future development.
