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Equipment Migration to New URFMS System (Phase 2)

1 Dec 2022

Announcement

Equipment (Denton E-Beam Explorer, Denton Sputtering System, Denton Thermal Evaporator, DektakXT Surface Profiler, Probe Station with Analyzer, Atomic Layer Deposition System, Rapid Thermal Processor and Inductively Coupled Plasma Etcher) will be migrated to new URFMS platform, Booking and usage charges will be handled by the new URFMS platform under RIO on and after 2022 Dec 22. Please sign-in and setup account in URFMS (https://urfms.polyu.edu.hk/facilities) to reserve the equipment.


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