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Magentron Sputtering / Thermal Evaporation Deposition Platform (Kurt J. Lesker PVD 75)

Introduction:

SPUTBThin film deposition is an important process in the opto-electronic and semiconductors devices fabrication. Physical Vapor Deposition (PVD) is a group of techniques which vaporizing or sputtering solid source material under high vacuum conditions and then redepositing thin film of material onto a substrate surface. The two most common techniques of PVD are Sputtering and Thermal Evaporation.
Magnetron sputtering uses magnetron to generate a plasma within a vacuum chamber. Ionized gas atoms collide with the target material and sputtering atoms or molecules from the target surface and condense a thin film on substrate. Sputtering allows high-quality and highly adherent thin films deposition with precise thickness control. 
Thermal evaporation uses resistive heat source heats the solid material until vaporization temperature. The vapor stream traverses the high vacuum chamber and coats the substrate, forming the thin film. This process may not be suitable for materials with high melting points or materials that are prone to degradation at high temperatures.
The KJLC PVD 75 has robust and versatile chamber design with good system base pressures and fast pump down times. The software control system provides intuitive and reliable recipe deposition process control.

 

Specifications / Features:

  • • High-vacuum chamber, base pressure better than 5 x 10-7 Torr
    • Substrate size: Up to 6”
    • Substrate rotation: 0 – 20 rpm
    • Substrate heating: N/A
    • Sputtering source: 500W DC source
    • Thermal source: 400A 2kW
    • Mass flow controller: 0 - 100 sccm
    • Thickness control: eKLipse deposition control
    • Uniformity accords 6" wafer better than +/-5%
    • Sputter target: 2” diameter 0.375 thickness maximum, with TORUS® Mag Keeper™ and "elastomer" bond
    • Sputter target available: Aluminum, Chromium, Copper, Gold, Silver, Titanium
    • Resistive heat source: Tungsten pan trough boats 140A 
     

 

Notes to user:

High vapor pressure material is forbiddened to use in all vacuum system which can cause contamination in the chamber and subsequent films.

 

Supplier information:

         https://www.lesker.com/process-equipment-division/thin-film-systems/pro-line-pvd-75-deposition-platform.cfm

 

Please click here to download the equipment introduction poster.

 

Equipment location:

Room BC718

 

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