Introduction:
Magnetron Sputtering is a physical vapor deposition that commonly use to deposit the metal and semiconductor materials. Sputtering can usually produce high-quality film with a uniform thickness over few inch of areas. These deposition involved argon ions under influence of electric field bombarded the target surfaces and ejected atoms travelled towards the substrate.
Specifications / Applications:
- High-vacuum chamber (base pressure: 10-5 Torr)
- 2 inch sputter sources (normal incidence) x 3 (allowed co-sputtering of metallic materials only)
- DC sputtering power source (Advanced Energy Maximum power : 1kW)
- Substrate holder (3 inch)
- Substrate temperature (room temperature only)
- Manual control
- Target materials available: Aluminum, Chromium, Copper, Gold, Silver, Titanium
Notes to user:
N/A
Equipment location:
Room BC718
