Introduction:
Magnetron sputtering is a highly versatile technique for the deposition of of very dense films with excellent adhesion. A type of physical vapor deposition (PVD) coating technology, magnetron sputtering is a plasma-based coating process where a magnetically confined plasma is created near the surface of a target material. Positively charged energetic ions from the plasma collide with the negatively charged target material, and atoms from the target are ejected or “sputtered”, which then deposit on a substrate.
Specifications:
- Substrate size: Up to 4”
- Substrate rotation: 0 – 20 rpm
- Vacuum: Achieve to 10-7 Torr
- Target source: 3” target × 2 and 2” target × 2
- Thickness control: Inficon deposition controller
- Sputtering mode: RF and DC
- Film uniformity: ± 3%
- Substrate heater: Maximum 500°C
- Mass flow controller: 100 sccm full scale
Notes to user:
User should weight the materials (Au, Pd, Pt) before and after deposition and write down on the log book, otherwise the materials cost will be charged by estimation.
Supplier information:
Please click here to download the equipment introduction poster.
Equipment location:
Room HJ705 (Class 1,000)
