A seminar on Surface integrity issues in ultraprecision machining
Speaker: Prof. Jiwang Yan
Date: 31st March, 2016 (Thursday)
Time: 15:30 – 17:00
Jiwang Yan is a professor of Mechanical Engineering at Keio University, Japan, and the director of Laboratory for Precision Machining and Nano Processing. His research interests include ultraprecision machining, micro/nano manufacturing, material processing and optical fabrication. He has been working for more than 20 years on ultraprecision machining of advanced materials such as silicon, germanium, silicon carbide, diamond, glass, ceramics and composites, and developed a series of novel fabrication processes for optics, optical molds, cutting/grinding tools and semiconductor substrates.
Ultraprecision machining of semiconductor materials such as silicon, germanium, and silicon carbide in the micro-nano scale has been an area of focused research interests. Apart from surface roughness and form accuracy, microstructural change of the surface layer of workpiece materials during the machining process is a critical issue for the surface integrity of the machined components. In this talk, recent research results of the speaker's group on surface integrity in ultraprecision machining of various materials will be introduced. The topics will include the formation mechanisms and the evaluation methods for different kinds of subsurface damages, as well as a laser recovery technology for the subsurface damages.
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