Curvature-adaptive Multi-jet Freeform Polishing System for Precision Manufacturing

Project_Curvature-adaptive Multi-jet Polishing System

High efficiency multi-jet polishing of freeform surfaces by controlling the fluid pressure of each jet

Polishing freeform surfaces is a great engineering challenge, as the curvature effect always results in considerable residual errors. Our novel technology enables jet array customization and real-time control and adjustment of the fluid pressure of each jet according to surface curvatures, in order to compensate residual errors induced by the curvature effect. Compared to conventional single jet polishing, it tremendously enhances the efficiency and accuracy of freeform surface polishing. It has been developed into a portable apparatus which can be integrated into various types of machines such as polishing machines, robotic arms and 3D printing machines.

Special Features and Advantages

Greatly enhances the polishing efficiency as compared to traditional single jet polishing, while maintaining high surface quality

Controls the fluid pressure of each jet for material removal independently according to the curvatures of the freeform surface

Portable apparatus that can be integrated with different machines

Applications

Post-process finishing of freeform surfaces made of different materials in various fields such as biomedical (e.g. orthopedic implants), optics (e.g. freeform lenses and molds), and aerospace (e.g. turbine blades)

Post-process finishing of 3D-printed complex components

Awards & Patents

Best Paper Award - The 14th China-Japan International Conference on Ultra-Precision Machining Process (Sept 2018)

Silver Medal – 47th International Exhibition of Inventions of Geneva, Switzerland (Apr 2019)

Special Merit Award from University Politehnica of Bucharest, Romania (Apr 2019)

Special Merit Award from Romanian Association for Nonconventional Technologies, Romania (Apr 2019)

Patent Application No. and Country:

201710036690X, 2017100138091, 2018103008855 (China)

Principal Investigator

Ir. Prof. Benny Chi-fai CHEUNG

Department of Industrial and Systems Engineering

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