Research Engineer & Assistant Professor

Dr. Cheng Ching-Hsiang









3400 3523



2764 0011



  Area of Specialization

Integrated Microfluidic Systems, Capacitive Micromachined Ultrasonic Transducers (CMUT) for Medical Ultrasonic Imaging, Piezoelectric Micromachined Ultrasonic Transducers (PMUT) for Biomedical Applications, Electrical Through-Wafer Interconnects, Nanoimprint Technology, Biomedical Pressure Sensors, Microelectromechanical Systems (MEMS).


  Short Description

Ching-Hsiang Cheng is a Research Engineer and also Assistant Professor in the Research Institute of Innovative Products & Technologies, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong.

Ching-Hsiang Cheng was born in Taipei,Taiwan. He received the B.S. degree in Mechanical Engineering from National Taiwan University in 1993. After completeing the military service in 1995, he got admission from Cornell University, NY, U.S.A. and awarded with Master’s degrees in both Mechanical and Electrical Engineering from Cornell University in 1998. During his master's study, he has developed biomedical pressure sensors, variable capacitors, and optical accelerometer using MEMS technology. Following his master's degree, he joined Professor Khuri-Yakub’s Ultrasonics Group in Electrical Engineering at Stanford University, CA and received his Ph.D. degree in 2005. During his doctoral research, he has developed electrical through-wafer interconnects to integrate the 2D capacitive micromachined ultrasonic transducer (CMUT) arrays with electronics, which has only 0.05 pF of parasitic capacitance for each interconnect. He has also developed CMUT for different applications including medical ultrasonic imaging, underwater camera, SAW filter, and Non-Destructive Inspection (NDI). After receiving his doctoral degree, he was invited to join Professor Kenneth Goodson’s Microscale Heat Transfer Group in Mechanical Engineering also in Stanford University as a postdoctoral scholar. He has developed a microfluidic system with integrated sensors and heaters for microprocessor cooling and fuel cell applications. After completing his postdoctoral research, he joined Industrial Technology Research Institute (ITRI) in Taiwan as a researcher and became a project leader after three months. He has developed tactile and thermal sensor arrays for robotics applications and nanoimprint technology for forming of micro to nano scale miniature polymeric based devices. In 2006, he has been appointed as a Research Engineer and also Assistant Professor in the Research Institute of Innovative Products and Technologies (RIIPT) of The Hong Kong Polytechnic University. His research interests include microfluidic systems with integrated sensors and actuators, capacitive micromachined ultrasonic transducers (CMUT), electrical through-wafer interconnects, polymeric tactile sensor arrays, nanoimprint technology, and microelectromechanical systems (MEMS) for healthcare applications.


  Previous Projects

  • Development of tactile and thermal sensor arrays for robotics applications.

  • Nanoimprint of micro to nano scale miniature polymeric based devices.

  • Advanced inkjet printing technology for variety of applications including flat panel displays and color filters.

  • Development of miniature electrical power generator for lighting of pneumatic tools and bicycles.

  • Microchannels with Integrated Sensors and Heaters.

  • Electrical Through-Wafer Interconnects for 2-D Capacitive Micromachined Ultrasonic Transducers (CMUT) Arrays.

  • Capacitive Micromachined Ultrasonic Transducers (CMUT).

  • A Micromachined Biomedical Pressure Sensor.

  • A Surface Micromachined Optical Accelerometer.

  • Surface Micromachined Variable Capacitors.

  • Pressurized Underfill Encapsulation of Flip-Chip on Board.

  Selected Publications

  •  Fogg, D., Cheng, C.H., and Goodson, K.E., "Design Considerations for the Effects of Liquid Compressibility in Microchannel Flow Boiling," Proc. IMECE 2006, Paper No. IMECE2006-14380, Nov. 5-10, 2006, Chicago, IL, USA. (draft submitted).
  • R. Flynn, T.A. Kramer, J.-M. Koo, D.W. Fogg, C. H. Cheng, E.N. Wang, K.E. Goodson, 2005, "Convective Boiling in Silicon Microchannels with Localized Heating and Thermometry," 3rd International Conference on Microchannels & Minichannels, Toronto, Canada, June 13-15, ICMM2005-75209.
  • Hidrovo, C. H., Kramer, T. A., Wang, E. N., Vigneron, S., Steinbrenner, J. E., Koo, J.-M., Wang, F.-M.,  Fogg, D. W., Flynn, R. D., Lee, E. S., Cheng, C. H., Kenny, T. W., Eaton, J. K. and Goodson, K. E., “Two-Phase Microfluidics for Semiconductor Circuits and Fuel Cells”, ICMM2005:  3rd International Conference on Microchannels and Minichannels, June 13-15, 2005, Toronto, Ontario, Canada (keynote paper).
  • C. H. Cheng, A. S. Ergun, B. T. Khuri-Yakub, “Electrical Through Silicon Wafer Interconnects for High Frequency Photodetector Arrays,” Photonic Devices and Systems Packaging Symposium PhoPack 2002, Stanford, California, 7/14-16/2002, pp. 54-7.
  • C. H. Cheng, A. S. Ergun, B. T. Khuri-Yakub, “Electrical Through Wafer Interconnects with 0.05 Pico Farads Parasitic Capacitance on 400 mm Thick Silicon Substrate,” Solid-State Sensor, Actuator, and Microsystems Workshop 2002, Hilton Head Island, South Carolina, 6/2-6/2002, pp. 157-160.
  •  C. H. Cheng, A. S. Ergun, B. T. Khuri-Yakub, “Electrical Through-Wafer Interconnects with Sub-PicoFarad Parasitic Capacitance,” MEMS Conference 2001, Berkeley, California, August 24-26, 2001.
  • C. H. Cheng, E. M. Chow, A. S. Ergun, B. T. Khuri-Yakub, “An Efficient Electrical Addressing Method Using Through-Wafer Vias for Two-Dimensional Ultrasonic Arrays,” 2000 IEEE International Ultrasonics Symposium, San Juan, Puerto Rico, October 22-25, 2000.
  •  A. S. Ergun, C. H. Cheng, U. Demirci, B. T. Khuri-Yakub, “Fabrication and Characterization of 1-dimensional and 2-dimensional Capacitive Micromachined Ultrasonic Transducer (CMUT) arrays for 2-dimensional and Volumetric Ultrasonic Imaging,” Oceans 2002, MTS/IEEE, Biloxi, Mississippi, October 29-31, 2002, vol.4, pp. 2361 – 2367.
  • S. Calmes, C. H. Cheng, F. L. Degertekin, X. C. Jin, and B. T. Khuri-Yakub, “Highly Integrated 2-D Capacitive Micromachined Ultrasound Transducers,” presented at the 1999 IEEE International Ultrasonics Symposium, Lake Tahoe, Nevada; in Ultrasonics Symposium Proceedings, pp. 1163-6. (Octobor 17-20, 1999)
  • X. C. Jin, C. H. Cheng. O. Oralkan, S. Calmes, F. L. Degertekin, and B. T. Khuri-Yakub, “Recent Progress in Capacitive Micromachined Ultrasonic Immersion Transducer Array,” presented at the 8th International Symposium on Integrated Circuits, Devices and Systems, Singapore; in ISIC-99 Proceedings, pp.159-162. (September 8-10, 1999)
  •  Y. Chen, C. Cheng, H. Lee, A. Liu, and N. Tien, “A Polysilicon Surface Micromachined Accelerometer Based on Optical Intensity Modulation,” International Conference on Optical MEMS and Their Applications, MOMEMS97, pp. 121-125, 1997.


Design and Fabrication of Microelectromechanical Systems (MEMS), Semiconductor Device Physics, Fabrication of Semiconductor Devices.



Integrated Microfluidic Systems, Ultrasonic Transducers, Drug Delivery Systems, Electronic Travel Aid Devices, Microelectromechanical Systems (MEMS).