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2014 年 12 月 02 日
Seminar - Mesoscale Simulations of Boiling Heat Transfer Phenomena: A New Approach for Phase-Change Heat Transfer Research By Prof. Ping Cheng

Prof. Ping Cheng

Member of Chinese Academy of Sciences, School of Mechanical Engineering, Shanghai Jiaotong University

Chair Professor* of Mechanical Engineering under the Distinguished Chair Professor Scheme, Department of Mechanical Engineering, PolyU (*Visiting Part-time )


Date: 2 December 2014 (Tuesday)

Time: 10:45 am – 12:00 noon

Venue: AG710, The Hong Kong Polytechnic University



This talk will include two parts. In the first part the development of innovative
methods for characterizing the mechanical properties of nanowires, nanobelts and
ultrathin films will be introduced. In the second part the fundamental understanding of
deformation mechanisms of a thin film multilayered structure under mechanical loading
and its removal characteristics involved in abrasive machining will be discussed.

Because of its high heat transfer rate, boiling heat transfer has been a subject of extensive study during the past century for cooling of thermal devices and energy conversion systems. In the past 80 years, boiling heat transfer research has been mostly experimental in nature with correlation equations obtained in terms of dimensionless parameters. While these correlation equations are useful for practical design consideration, they are unable to provide fundamental understanding of boiling heat transfer mechanisms. On the other hand, because of the complex physical process involving bubble deformation and coalescence as well as interfacial heat and mass transfer in boiling heat transfer, numerical simulations of the phenomena remain to be one of the unsolved problems in computational heat transfer. In this lecture, the newly developed Gong-Cheng’s phase-change lattice Boltzmann method will be introduced. Based on this mesoscale numerical method, boiling patterns on a heated smooth surface, from bubble nucleation to critical heat flux, to partial and stable film boiling at different degrees of superheat, are simulated. The well known Nukiyama boiling curve for smooth heated surface is simulated for the first time. The size and wettability effects of microstructured surfaces on boiling heat transfer are illustrated. This newly developed method can also be applied to simulate effects of wettability and roughness on filmwise and dropwise condensation on subcooled surfaces. Current research focus on this newly developed numerical method for phase-change heat transfer will also be discussed. 


Prof. Ping Cheng, a member of Chinese Academy of Sciences, is a Chair Professor in School of Mechanical Engineering at Shanghai Jiaotong University. He was the recipient of The Hong Kong Polytechnic University Distinguished Chinese Visiting Scholar Scheme 2012. Prior to his present position, he served as Chairman of Mechanical Engineering at University of Hawaii (1989-1994) and as 2nd Head of Mechanical Engineering Department at Hong Kong University of Science and Technology (1995-2002).

Prof. Cheng received his B.S. degree in Mechanical Engineering from Oklohama State University, M.S.  in Mechanical Engineering from MIT, and PhD in Aeronautics and Astronautics from Stanford University. He has done seminal research work in radiative gasdynamics (with applications to re-entry of space crafts), porous media heat transfer (with applications to geothermal energy and fuel cells), and microscale heat transfer (with applications to cooling of micro-electronic chips).  He has published over 200 SCI journal papers in these areas that have been cited more than 6700 times according to Science Citation Index (SCI), achieving an H-factor of 44. He was listed by Thomson Reuters in 2014 as one of the world’s “Highly Cited Researchers”.

A Fellow of both American Society of Mechanical Engineers (ASME) and  American Institute of Aeronautics and Astronautics (AIAA), Prof. Cheng has received four  top international honors including: 1996 ASME Heat Transfer Memorial Award , 2003 AIAA Thermophysics Award,   2006 ASME Heat Transfer Classic Paper Award, and  2005 ASME/AIChE Max Jackob Award (considered to be the highest international honor in the field of heat transfer). He was also one of the recipients of 2007 Natural Science Awards of China (2nd class category).  

Prof. Cheng is presently serving as an Editor of Int. J. Heat Mass Transfer and Editor of Int. Comm. Heat Mass Transfer, and is on editorial boards of 15 international heat transfer journals. He will be chairing the 16th Int. Heat Transfer Conference (held every fourth years) to be held in Beijing on Aug.10-18, 2018.