Hong Kong Electronic Industry Summit on Latest Acoustic Technology and Product Design, Hong Kong
About a hundred of engineers, product designers and PolyU students, were gathering in the thematic Hong Kong Electronic Industry Summit on Latest Acoustic Technology and Product Design on 15 October 2013 during the Hong Kong Electronics Fair 2013 (Autumn Edition) which was the world's biggest event in electronics industry in the year. It was the very first time that this high-level forum focusing on the design and technology for audio product development was held in the Fair.
The Summit was jointly organized by Hong Kong Trade Development Council (HKTDC), The Hong Kong Electronic Industries Association (HKEIA), Hong Kong Science and Technology Parks Corporation (HKSTPC), Department of Mechanical Engineering of The Hong Kong Polytechnic University (PolyU–ME), and is supported by The Hong Kong Electronics Industry Council (HKEIC) and the Hong Kong Institute of Acoustics (HKIOA).
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