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BIP Asia Forum 2022 - Innovation & IP Market

Exhibition

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  • Date

    01 - 02 Dec 2022

  • Organiser

    HKSAR Government, Hong Kong Trade Development Council and Hong Kong Design Centre

  • Time

    09:30 - 17:30

  • Venue

    Hall 5FG, Hong Kong Convention and Exhibition Centre | In-person & Online  

Summary

To strengthen IP commercialisation and facilitate industry collaboration, Innovation & IP Market will be launched at BIP Asia Forum 2022. Staging alongside the main forum, the Innovation & IP Market is a marketplace for enterprises to acquire innovation and technologies for manufacturing upgrading and business transformation. It consists of: Inno Showcase, Open Stage and Tech Consultation Salon on the spot.

With the theme “Smart Manufacturing and Building”, the Innovation & IP Market target to gather universities, R&D centres, start-ups and companies with IPs focusing in AI, Robotics, IoT, Advanced Materials, etc. to meet with IP users, service providers and investors for networking and partnership building.

Inno Showcase presentation of over 30 home-grown innovations from universities, R&D centre and start-ups applicable for a wide spectrum of sectors including manufacturing, construction, property development, transportation, energy, healthcare & beauty, etc. 

PolyU's innovations will be showcased including:

  1. Smart City Platform: A Comprehensive System for Spatial Data Infrastructure (Booth#5F-G05)
  2. UmiCool: an Eco-friendly Smart Sub-ambient Radiative Cooling (SSRC) Coating (Booth#5F-G06)
  3. Novel Laser Polishing Technology for Additive Manufactured Metal Objects (Booth#5F-F07)
  4. Curvature-adaptive Multi-jet Freeform Polishing System for Precision Manufacturing (Booth#5F-F08)
  5. Autostereoscopic In-situ 3D Measurement System (Booth#5F-F09)


Open Stage
– Intelligence, insights and experience sharing on global trends and best practices on IP & tech commercialisation and adoption.

1 Dec

17:00-17:15

                          

Bringing Tech to Business (在商『研』商) Innovation Demo
(Co-organised with The Chinese Manufacturers' Association of Hong Kong)

UmiCool: an Eco-friendly Smart Sub-ambient Radiative Cooling (SSRC) Coating
Prof. Jianguo Dai, Professor, Department of Civil and Environmental Engineering, The Hong Kong Polytechnic University

More details

 

 

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