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Mr. Kok, Wai Hoong, who is a first year PhD student in the Department of Industrial and Systems Engineering (ISE), received an “Outstanding Project Award, From Research to Business 2015”, a competition conducted by the Institute for Entrepreneurship, The Hong Kong Polytechnic University.

Wai Hoong and three other team members won the award with a project entitled “Hot Solutions”.

The motto of their project is “Our solution takes away heat from 3D IC for it to work” and is aimed to provide a material and process solution on heat management for the electronic industry, specifically for 3D Integrated Circuits (3D IC).  The technology to be developed will be a key part of Wai Hoong’s PhD research project.  He intends to formulate a material which has at least 250 times better heat dissipation capability than current polymer packaging material, also known as epoxy molding compound.  In addition, he will also develop a process for building a 3D Interposer to be used for the fabrication of 3D IC.  3D IC is listed as one of the key disruptive technologies by the year 2022 in a report by IEEE on February 2014 entitled “IEEE CS 2022 Report”. This research is expected to contribute significantly to this development.

 

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Mr. Kok Wai Hoong (right) was presented with the Outstanding Project Award by Ms. Kiki Wang of Hong Kong Science and Technology Parks (HKSTP)