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Mr. Kok, Wai Hoong, who is a first year PhD student in the Department of Industrial and Systems Engineering (ISE), received an “Outstanding Project Award, From Research to Business 2015”, a competition conducted by the Institute for Entrepreneurship, The Hong Kong Polytechnic University.

Wai Hoong and three other team members won the award with a project entitled “Hot Solutions”.

The motto of their project is “Our solution takes away heat from 3D IC for it to work” and is aimed to provide a material and process solution on heat management for the electronic industry, specifically for 3D Integrated Circuits (3D IC).  The technology to be developed will be a key part of Wai Hoong’s PhD research project.  He intends to formulate a material which has at least 250 times better heat dissipation capability than current polymer packaging material, also known as epoxy molding compound.  In addition, he will also develop a process for building a 3D Interposer to be used for the fabrication of 3D IC.  3D IC is listed as one of the key disruptive technologies by the year 2022 in a report by IEEE on February 2014 entitled “IEEE CS 2022 Report”. This research is expected to contribute significantly to this development.



Mr. Kok Wai Hoong (right) was presented with the Outstanding Project Award by Ms. Kiki Wang of Hong Kong Science and Technology Parks (HKSTP)