Conventional 3D measurement devices are installed in fixed position and the variants cannot be calculated and compared accurately. In view of this, Prof. Benny Cheung Chi-fai and his research team at the Department of Industrial and Systems Engineering have developed a “Portable 3D multisensor measurement apparatus” to enhance the measurement accuracy.
Comprising a motion sensor and laser scanner, this novel apparatus can be combined to various types of machine tools to inspect products without moving them around and to perform in-situ and in-process High Dynamic Range 3D surface measurement in manufacturing environments. Also, it can help compare the testing products with the original design, allow adjustment in manufacturing data when variants are found during production process and improve the production efficiency. This apparatus can be used in robotics arms and on lines inspection system for production automation; thus fostering the development of Industry 4.0.
This invention won a Gold Medal at the 44th International Exhibition of Inventions of Geneva in Switzerland.